Simpoe3D is one of package of Simpoe-Mold, Simpoe3D is a full solid model simulation package, which involves high light technology to simulate practical injection process, and also supprots multi-kernal parallel computation. Simpoe3D contains completely FLOW-PACK, COOL and WARP modules.
Simpoe3D FLOW-PACK is CFD grade simulation of fully three dimensional trasient, non-isothermal, non-Newtonian plastic injection molding filling and packing processes, the analysis adapts to various molding processes simulation, such as thermo-plastic material injection, co-injection, gas-assisted injection, fiber orientation and residual stress predictions. Additionally, it could also apply to the reactive injection molding process simulation. Furthermore, FLOW-PACK is also a general purpose Multi-Domain injection process simulation tool, which could solve insert molding process and multi-domain injection process simulation, or hybrid of both molding processes. Specially, FLOW-PACK provides completely types of solvers (segregated and coupled) for simulation process.
SImpoe3D FLOW-PACK with fast fiber orientation computation process and could provide transverse-isotropic residual stress for warpage (WARP) simulation. Additionally, FLOW-PACK involves hot runner function, and only increase a few memory spaces, FLOW-PACK could couple with COOL to read fully transient mold temperature which is much close the real mold temperature profiles to get the high accuracy results.
Simpoe3D COOL is a transient cooling simulation of plastic part, mold and cooling system, which could involve multi-mold material domains and multi-injection domains or inlay cases. COOL could output transient temperature profile for FLOW-PACK simulation. Although thermal field of COOL and FLOW-PACK may with different type boundary conditions, theoretically, temperature profile from COOL and FLOW-PACK should be consistent for coupled process. SImpoe3D WARP is the deformation analysis based on transverse isotropic residual stress, which could also involve multi-injection domains or inlay cases.